The Global Failure Analysis market is accounted for $4.51 billion in 2014 and is expected to reach $8.3 billion by 2022 to grow at a CAGR of 7.95%. The Failure Analysis is to analyze the root cause of failure, problems in design issues, assembly issues and silicon issues. Some of the key drivers include industrial advancement and increasing Applications of Failure Analysis. High Equipment and maintenance cost are the restraint factors for the growth of market.
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Global Failure Analysis market is segmented by Technology, by Equipment, by Applications, and by Geography. Depending on the Technology, market is segregated into Broad ion milling (BIM), Focused ion beam (FIB), Reactive ion etching (RIE), Secondary ion mass spectroscopy (SIMS), Energy dispersive X-ray spectroscopy (EDX) and Chemical mechanical planarization (CMP).
Based on Equipment, market is classified into Transmission electron microscope (TEM), Focused ion beam system (FIB), Scanning electron microscope (SEM) and Dual – Beam (FIB/SEM). Based on Application, market is categorized into Bio Science, Material Science, Industrial & Electronics, Fiber optics, Nanotechnology, nonmaterial’s and Polymers. Failure Analysis market by geography is segmented into North America, Europe, Asia Pacific and Rest of the World.
The Key players in the Global Failure Analysis market include, JEOL, Ltd., FEI Company, Tescan, Hitachi High%li%Technologies, Carl Zeiss SMT GmbH, EAG (Evans Analytical Group) Inc., Motion X Corporation, Intertek Group Plc, A&D Company Ltd.
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